The **ATS-10D-92-C2-R0** is a high-performance electronic component specifically designed for **Thermal Management**. It is a heat sink manufactured by *Advanced Thermal Solutions (ATS)*, part of their high-performance "push-pin" series. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the device: | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Straight Fin | | **Dimensions (L x W)** | 40mm x 40mm | | **Height (H)** | 15mm | | **Mounting Hole Pitch** | 33mm | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 100 LFM) | --- ## 2. Component Composition The part consists of four main sub-components that work together to dissipate heat from electronic devices (like CPUs, FPGAs, or MOSFETs): 1. **Heat Sink Body:** Extruded aluminum with a specific fin density to maximize surface area for air convection. 2. **Push-Pins:** Plastic or brass pins that pass through the PCB to secure the unit. 3. **Springs:** Compression springs that provide consistent downward pressure (TIM contact pressure) to ensure efficient heat transfer. 4. **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease/pad. --- ## 3. Key Electronic Functions * **Heat Dissipation:** Its primary role is to lower the junction temperature ($T_j$) of a semiconductor to prevent thermal throttling or hardware failure. * **Thermal Conductivity:** Utilizes high-grade aluminum to pull heat away from the silicon die. * **Airflow Optimization:** The straight fin design is optimized for environments where there is a consistent directional airflow (system fans). --- ## 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **10D** | Push-pin style and spring tension | | **92** | Specific dimension/fin configuration | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code | ---