Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-10D-94-C2-R0

  • AI
    The **ATS-10D-94-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic surface-mount devices (SMDs) like CPUs, GPUs, or power transistors. --- ### Technical Specifications The table below summarizes the core technical parameters of this component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.49°C/W (at 100 LFM) | | **Dimensions** | 40mm x 40mm x 25mm | | **Fin Style** | Fine Pitch (straight) | --- ### Key Features and Electronic Design #### 1. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical push-pin system. This is critical for electronic stability because: * It provides **consistent pressure** across the component surface, ensuring optimal thermal interface material (TIM) performance. * It allows for **secure mounting** in high-vibration environments (e.g., aerospace or automotive electronics). #### 2. Thermal Resistance Performance Thermal resistance (measured in °C/W) indicates how effectively the part moves heat away from the silicon. The performance varies based on airflow (LFM - Linear Feet per Minute): | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 4.49°C/W | 1.82°C/W | 1.30°C/W | #### 3. Material and Coating * **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; anodization increases surface emissivity and provides a layer of electrical insulation and corrosion resistance. --- ### Application in Circuitry The **ATS-10D-94-C2-R0** is typically used on high-power integrated circuits (ICs) where passive cooling is insufficient. It is commonly found in: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial controllers that generate significant heat. * **Power Supplies:** Cooling voltage regulators and power MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What are the compatible hole patterns for the push-pin attachment on this heat sink?
    • ⤷ How does the 'C2' designation in the part number relate to the Thermal Interface Material?
    • ⤷ Can this heat sink be used with a cooling fan for active thermal management?