ATS-10D-94-C2-R0
AI

The **ATS-10D-94-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic surface-mount devices (SMDs) like CPUs, GPUs, or power transistors.
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### Technical Specifications
The table below summarizes the core technical parameters of this component:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Type** | Push-Pin (Spring-loaded) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 4.49°C/W (at 100 LFM) |
| **Dimensions** | 40mm x 40mm x 25mm |
| **Fin Style** | Fine Pitch (straight) |
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### Key Features and Electronic Design
#### 1. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this part uses a mechanical push-pin system. This is critical for electronic stability because:
* It provides **consistent pressure** across the component surface, ensuring optimal thermal interface material (TIM) performance.
* It allows for **secure mounting** in high-vibration environments (e.g., aerospace or automotive electronics).
#### 2. Thermal Resistance Performance
Thermal resistance (measured in °C/W) indicates how effectively the part moves heat away from the silicon. The performance varies based on airflow (LFM - Linear Feet per Minute):
| Airflow Velocity | 100 LFM | 300 LFM | 500 LFM |
| :--- | :--- | :--- | :--- |
| **Thermal Resistance** | 4.49°C/W | 1.82°C/W | 1.30°C/W |
#### 3. Material and Coating
* **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity.
* **Blue Anodized Finish:** This is not just for aesthetics; anodization increases surface emissivity and provides a layer of electrical insulation and corrosion resistance.
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### Application in Circuitry
The **ATS-10D-94-C2-R0** is typically used on high-power integrated circuits (ICs) where passive cooling is insufficient. It is commonly found in:
* **Networking Equipment:** High-speed routers and switches.
* **Embedded Systems:** Industrial controllers that generate significant heat.
* **Power Supplies:** Cooling voltage regulators and power MOSFETs.
- ⤷
What are the compatible hole patterns for the push-pin attachment on this heat sink?
- ⤷ How does the 'C2' designation in the part number relate to the Thermal Interface Material?
- ⤷ Can this heat sink be used with a cooling fan for active thermal management?