The **ATS-10E-101-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** heat sink assembly series, designed for cooling electronic components like CPUs, GPUs, or power transistors. --- ### 1. Key Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Thermal Resistance** | 6.74 °C/W (at 100 LFM) | | **Dimensions (LxW)** | 45mm x 45mm | | **Height** | 30mm | | **Fin Pitch** | Fine (Cross-cut) | --- ### 2. Major Components & Features #### A. The Heat Sink Body The body is made of **Aluminum 6063**, which is the industry standard for heat sinks due to its high thermal conductivity and lightweight properties. The **Blue Anodized** finish isn't just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer. #### B. Thermal Interface Material (TIM) The "C3" in the part number indicates that this unit comes with **T412 Phase Change Material**. * This material is pre-applied to the bottom surface. * When the component heats up, the TIM softens to fill microscopic air gaps between the heat sink and the chip, ensuring maximum heat transfer. #### C. PushPIN™ Attachment System Instead of using screws or adhesive tape, this model uses a **push-pin and spring mechanism**: * **Compression Springs:** Provide precise, even pressure across the component. * **Plastic Pins:** Quickly snap into pre-drilled holes on the PCB (Printed Circuit Board). --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.74 | | 300 (1.5 m/s) | 2.16 | | 500 (2.5 m/s) | 1.48 | | 700 (3.5 m/s) | 1.20 | --- ### 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Power Supplies:** Dissipating heat from MOSFETs or IGBTs. * **Industrial PCs:** Maintaining stability in fanless or forced-air environments.