The **ATS-10E-151-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. This part is designed to cool electronic components like CPUs, GPUs, or FPGAs by dissipating heat into the surrounding air. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Fin Type** | Straight Fin (for high-density airflow) | | **Dimensions** | 35mm x 35mm x 10mm | | **Thermal Resistance** | Approx. 17.60°C/W (at 200 LFM) | | **Thermal Interface** | T766 (Pre-applied thermal pad/grease) | --- ### 2. Design Breakdown #### A. The Heatsink (Body) The body is made of extruded aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The **blue anodized finish** is not just for aesthetics; it increases the surface emissivity, slightly improving radiation heat transfer and protecting the metal from corrosion. #### B. The Push-Pin Mechanism Unlike adhesive-based heatsinks, the "C2" series uses a mechanical push-pin system: * **Spring-loaded:** Ensures consistent downward pressure on the electronic chip, which is critical for maximizing the efficiency of the thermal interface material (TIM). * **Stability:** It is more secure against mechanical shock and vibration compared to double-sided tape. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates the specific thermal pad or grease pre-applied to the bottom. This fills the microscopic air gaps between the chip and the heatsink to ensure heat flows efficiently. --- ### 3. Typical Applications This specific part is often found in: * **Networking Equipment:** Routers and switches with mid-sized processors. * **Embedded Systems:** Industrial PCs where height constraints (10mm) are tight. * **Power Supplies:** Cooling voltage regulators or MOSFETs. --- ### 4. Cooling Performance Overview Below is a simplified representation of how air speed (LFM - Linear Feet per Minute) affects the thermal resistance of this part: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (Low Airflow) | 17.60 | | 400 (Moderate Airflow) | 6.70 | | 600 (High Airflow) | 4.50 |