ATS-10E-159-C1-R0
AI

The **ATS-10E-159-C1-R0** is a high-performance electronic cooling component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for secure attachment to Printed Circuit Boards (PCBs).
### 1. Technical Specifications
The following table summarizes the primary physical and thermal characteristics of this part:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Part Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimension (Length x Width)** | 45.00 mm x 45.00 mm |
| **Height (Off Base)** | 10.00 mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | ATS-PPS-10 |
| **Thermal Interface Material (TIM)** | No TIM (Pre-applied option available) |
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### 2. Thermal Performance Data
Thermal resistance determines how efficiently the heat sink moves heat away from the electronic component (CPU, FPGA, or GPU).
* **Thermal Resistance (Unducted Flow):** 10.68 °C/W @ 100 LFM (Linear Feet per Minute).
* **Thermal Resistance (Ducted Flow):** 2.11 °C/W @ 800 LFM.
* **Efficiency:** As airflow increases, the thermal resistance drops significantly, making it ideal for systems with active fan cooling.
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### 3. Key Electronic Design Features
#### A. Fin Geometry
This model utilizes a **Square-Fin** pattern. This design allows for multidirectional airflow, which is critical in dense electronic enclosures where the direction of air from cooling fans might be turbulent or obstructed.
#### B. Attachment Mechanism
The "Push-Pin" system consists of:
1. **Brass Pins:** Provide durable, repeatable attachment.
2. **Compression Springs:** Ensure consistent pressure between the heat sink base and the component surface, maximizing heat transfer.
#### C. Component Protection
The **Blue Anodized** finish is not just aesthetic; it provides:
* Increased corrosion resistance.
* Electrical insulation (to a minor degree).
* Enhanced surface emissivity for better radiation heat transfer.
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### 4. Application Use-Cases
The ATS-10E-159-C1-R0 is typically found in:
* **Network Switches/Routers:** Cooling high-speed processors.
* **Embedded Systems:** For low-profile industrial computers.
* **Power Supplies:** Managing heat in voltage regulators.
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What are the alternative attachment methods for ATS heat sinks if push-pins are not suitable?
- ⤷ How does the 'Blue Anodized' finish compare to 'Black Anodized' in terms of thermal performance?
- ⤷ How do I calculate the required LFM for my specific electronic component?