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  • ATS-10E-159-C1-R0

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    The **ATS-10E-159-C1-R0** is a high-performance electronic cooling component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimension (Length x Width)** | 45.00 mm x 45.00 mm | | **Height (Off Base)** | 10.00 mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | ATS-PPS-10 | | **Thermal Interface Material (TIM)** | No TIM (Pre-applied option available) | --- ### 2. Thermal Performance Data Thermal resistance determines how efficiently the heat sink moves heat away from the electronic component (CPU, FPGA, or GPU). * **Thermal Resistance (Unducted Flow):** 10.68 °C/W @ 100 LFM (Linear Feet per Minute). * **Thermal Resistance (Ducted Flow):** 2.11 °C/W @ 800 LFM. * **Efficiency:** As airflow increases, the thermal resistance drops significantly, making it ideal for systems with active fan cooling. --- ### 3. Key Electronic Design Features #### A. Fin Geometry This model utilizes a **Square-Fin** pattern. This design allows for multidirectional airflow, which is critical in dense electronic enclosures where the direction of air from cooling fans might be turbulent or obstructed. #### B. Attachment Mechanism The "Push-Pin" system consists of: 1. **Brass Pins:** Provide durable, repeatable attachment. 2. **Compression Springs:** Ensure consistent pressure between the heat sink base and the component surface, maximizing heat transfer. #### C. Component Protection The **Blue Anodized** finish is not just aesthetic; it provides: * Increased corrosion resistance. * Electrical insulation (to a minor degree). * Enhanced surface emissivity for better radiation heat transfer. --- ### 4. Application Use-Cases The ATS-10E-159-C1-R0 is typically found in: * **Network Switches/Routers:** Cooling high-speed processors. * **Embedded Systems:** For low-profile industrial computers. * **Power Supplies:** Managing heat in voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods for ATS heat sinks if push-pins are not suitable?
    • ⤷ How does the 'Blue Anodized' finish compare to 'Black Anodized' in terms of thermal performance?
    • ⤷ How do I calculate the required LFM for my specific electronic component?