The **ATS-10E-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number itself contains encoded specifications regarding its dimensions and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Base Dimensions** | 35.00mm x 35.00mm | | **Height** | 10.00mm | | **Pitch** | Fine Pitch (High density fins) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | ~22.48°C/W (Unducted Flow) | --- ### 2. Key Design Elements #### A. The pushPIN™ Attachment System This part utilizes a specific attachment mechanism designed for secure and easy installation: * **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide a precise amount of downward pressure (Force), ensuring a consistent interface between the heat sink base and the component. #### B. Fin Geometry (Cross-Cut) The "E" in the part number often signifies a specific fin pattern. This model uses a **high-density fin array** which: * Increases the surface area for heat exchange. * Is optimized for **forced air cooling** (environments with fans). #### C. Thermal Interface Material (TIM) The "R0" designation usually indicates the inclusion of a pre-applied **Thermal Interface Material**. This is a layer of conductive paste or pad on the bottom of the heat sink that fills microscopic air gaps between the chip and the metal, significantly improving heat transfer. --- ### 3. Applications This specific heat sink is typically found in: * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Small power supplies or motor drivers where space is limited but heat generation is high. --- ### 4. Comparison of Airflow Performance Thermal resistance varies based on the velocity of air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 22.48 | | 300 (1.5 m/s) | 6.62 | | 500 (2.5 m/s) | 4.10 | ---