The **ATS-10E-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to maximize airflow and thermal dissipation for electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 37mm x 37mm x 23mm | | **Thermal Resistance** | 3.32°C/W @ 200 LFM (Linear Feet per Minute) | | **Attachment Method** | pushPIN™ | | **Pressure Spring** | Brass / Steel (Nickel Plated) | --- ### 2. Key Component Features #### A. The maxiFLOW™ Design Unlike traditional straight-fin heat sinks, the ATS-10E-48-C2-R0 uses a **flared fin geometry**. - **Efficiency:** The spread fins increase the surface area and reduce air pressure drop. - **Airflow:** It is designed to capture airflow from any direction, making it ideal for high-density PCB layouts where airflow may be obstructed. #### B. pushPIN™ Attachment System This part features a standardized mechanical mounting system known as **pushPIN™**: 1. **Easy Installation:** Uses a spring-loaded mechanism that snaps into pre-drilled holes in the PCB. 2. **Reliable Pressure:** Ensures consistent contact pressure between the heat sink and the electronic component (CPU, FPGA, or GPU), which is critical for thermal transfer. 3. **Hardware:** Usually includes a stainless steel or brass spring and a plastic/metal pin. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of Thermal Interface Material pre-applied to the base: - **T766 Phase Change Material:** This is a high-performance coating that softens at operating temperatures to fill microscopic air gaps between the heat sink and the chip. --- ### 3. Typical Applications This heat sink is commonly used to cool high-heat-generating electronic parts such as: * **FPGAs (Field Programmable Gate Arrays)** * **ASICs (Application-Specific Integrated Circuits)** * **Northbridge/Southbridge Chipsets** * **High-speed Networking Processors** ---