The **ATS-10E-65-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is specifically designed to handle high-power electronic components in constrained airflow environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10E-65-C2-R0 | | **Heat Sink Type** | maxiFLOW™ (High Performance) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 1.48 °C/W (at 200 LFM) | | **Flow Pattern** | Open-ended for maximum air intake | --- ### 2. Key Electronic Components Features #### A. Thermal Management (Efficiency) The primary role of this part is to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, FPGAs, or power transistors. The **maxiFLOW™** geometry features a tapered fin design that increases the surface area while minimizing pressure drop. #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism that distinguishes it from adhesive-based heat sinks: * **Precision:** Ensures uniform pressure across the electronic component for optimal thermal interface material (TIM) performance. * **Reliability:** Uses a brass or plastic pin with a stainless steel spring to lock the heat sink securely to the PCB via pre-drilled holes. #### C. Material and Coating * **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Besides aesthetics, the anodization protects against corrosion and slightly increases emissivity for better radiative heat transfer. --- ### 3. Application Use-Cases This specific heat sink is typically found in the following electronic systems: 1. **Telecommunications:** High-speed routers and switches where components are packed tightly. 2. **Embedded Computing:** Industrial PC boards where active cooling (fans) might be limited. 3. **Power Supplies:** Cooling voltage regulators and MOSFETs that generate significant heat under load. --- ### 4. Thermal Performance Comparison *Note: Performance varies based on Linear Feet per Minute (LFM) airflow.* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 1.48 | | 300 | 1.15 | | 400 | 0.98 | | 500 | 0.87 |