The **ATS-10E-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 1.50 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Pressure Requirement** | High Pressure (optimized for airflow) | --- ### 2. Key Components & Construction #### A. The Heat Sink Body The body is made of **Aluminum 6063**, which offers an excellent balance between thermal conductivity and weight. The **Blue Anodized** coating is not just for aesthetics; it provides corrosion resistance and slightly improves emissivity for radiant heat transfer. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or complex clips, this part uses a proprietary spring-loaded pin system. - **Springs:** Ensure constant, uniform pressure on the electronic component (TIM interface). - **Pins:** Usually made of brass or plastic, designed to snap into pre-drilled holes on the PCB (typically 3.175mm holes). #### C. Thermal Interface Material (TIM) The "R0" suffix generally indicates that the unit comes with a **pre-applied thermal interface material**. This is a phase-change or grease-based pad on the bottom of the heat sink that fills microscopic air gaps between the component and the metal, ensuring maximum heat transfer. --- ### 3. Application Use Cases This specific model is designed for high-density electronic environments: * **Networking Equipment:** Routers and switches with high-speed processors. * **Industrial PCs:** Devices operating in environments where passive or forced-air cooling is critical. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. --- ### 4. Thermal Performance Data (Typical) The efficiency of the ATS-10E-75-C3-R0 depends heavily on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 1.97 | | 200 (Unducted) | 1.50 | | 400 (Unducted) | 1.10 |