The **ATS-10E-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Component Type** | Heat Sink | Passive cooling device | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Enhances emissivity and prevents corrosion | | **Attachment Method** | Push Pin (Brass) | Secure mechanical mounting with springs | | **Dimensions** | 30mm x 30mm x 25mm | Standard square footprint | | **Fin Type** | Straight Fin | Optimized for unidirectional airflow | | **Thermal Resistance** | ~4.50 °C/W | Based on standard airflow (approx. 200 LFM) | --- ### 2. Design and Construction The electronic functionality of this part is centered around **heat dissipation**. Its structural design includes: * **High-Performance Fins:** The fins are designed to increase the surface area exposed to air, facilitating faster heat transfer from the electronic component (CPU, FPGA, or MOSFET) to the ambient environment. * **Thermal Interface Material (TIM):** This part typically comes pre-applied with **T766**, a high-performance thermal phase-change material that fills microscopic air gaps between the heat sink base and the electronic chip to minimize thermal resistance. * **Push Pin Mounting:** Unlike adhesive-based heat sinks, the "C2" designation indicates a mechanical attachment using brass push pins and springs. This provides consistent pressure (preload), which is critical for maintaining thermal contact during vibration or thermal cycling. --- ### 3. Application Use Cases This specific part is used in electronics where active or passive cooling is required for: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PC processors and controllers. 3. **Power Electronics:** Cooling voltage regulators and power converters. --- ### 4. Thermal Performance Overview The efficiency of the ATS-10E-80-C2-R0 depends on the velocity of the air moving through the fins: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 4.46 | | 400 (2.0 m/s) | 2.56 | | 600 (3.0 m/s) | 1.82 |