The **ATS-10E-84-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed for cooling electronic components like CPUs, GPUs, or FPGAs in high-density environments. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Heat Sink Type** | Push-pin style (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Thermal Resistance** | 6.74°C/W @ 100 LFM | | **Attachment Method** | Brass Push-Pin (2-hole pattern) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components Breakdown #### A. The Heat Sink Body The body is constructed from aluminum for its high thermal conductivity-to-weight ratio. The **blue anodized finish** is not just for aesthetics; it increases surface emissivity, aiding in heat radiation, and provides a protective layer against corrosion. #### B. The Push-Pin Mounting System Instead of using messy adhesives or permanent solder, this part uses a mechanical **Push-Pin and Compression Spring** system: - **Mechanical Stability:** Ensures constant pressure between the heat sink and the electronic chip. - **Vibration Resistance:** The spring-loaded nature makes it suitable for hardware used in industrial or mobile environments where vibration is common. - **Reusable:** Allows for easy maintenance or chip replacement. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes with **T766 thermal grease** pre-applied to the base. - **Purpose:** Fills microscopic air gaps between the component (silicon die) and the heat sink base. - **Efficiency:** Drastically reduces contact resistance, allowing heat to flow freely into the fins. --- ### 3. Thermal Performance Metrics Thermal management is measured by how much the temperature rises per watt of power consumed. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 6.74 | | 200 (Standard Fan) | 3.85 | | 400 (High Performance) | 2.80 | --- ### 4. Typical Applications * **Networking Hardware:** Routers, switches, and server blades. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Embedded Systems:** Industrial PCs where space is limited but heat density is high.