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  • ATS-10E-86-C2-R0

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    The **ATS-10E-86-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heatsink**. It belongs to the *maxiFLOW™* product line, designed for cooling high-power semiconductors and electronic components. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Material** | Blue Anodized Aluminum | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Style** | Tapered (maxiFLOW™ Design) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | ~3.04 °C/W (@ 1.0 m/s airflow) | | **Pressure Drop** | 0.23 (in-H2O) | --- ## 2. Key Electronic Components & Features The "electronic" aspect of this part refers to its physical integration with PCBs and its role in circuit stability: ### A. maxiFLOW™ Fin Geometry The fins are tapered to increase the surface area for heat dissipation while minimizing airflow resistance. This is critical for densely packed electronic enclosures where airflow may be limited. ### B. pushPIN™ Attachment System Instead of simple adhesives (which can degrade over time), this part uses a mechanical **pushPIN™** system. * **Spring-loaded mechanism:** Ensures consistent pressure between the heatsink and the electronic component (like a CPU, FPGA, or GPU). * **Reliability:** Prevents the heatsink from shifting during mechanical shocks or vibrations. ### C. Thermal Interface Material (TIM) The part typically comes pre-applied with a high-performance **Thermal Interface Material**. This fills the microscopic air gaps between the semiconductor package and the aluminum base, significantly reducing thermal resistance. --- ## 3. Applications This heatsink is commonly found in high-reliability electronic systems, including: * **Telecommunications:** Network switches and high-speed routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and high-current power modules.
    ✨ Follow-up Questions
    • ⤷ What are the different pushPIN attachment options available for this series?
    • ⤷ How does the blue anodized coating affect the thermal performance compared to bare aluminum?
    • ⤷ Can this heatsink be used for components smaller than 45mm x 45mm?