The **ATS-10E-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push pin" series designed for secure mounting on Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-10E-95-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 7.29°C/W (at 100 LFM) | --- ### 2. Design and Components This part is not just a block of metal; it is an engineered assembly consisting of several electronic-mechanical components: #### A. The Heat Sink Body * **High Aspect Ratio Fins:** The straight-fin design maximizes surface area to allow air to pass through easily, facilitating convection cooling. * **Material:** Made from Aluminum 6063, which offers a high thermal conductivity-to-weight ratio. #### B. The Attachment System (Push-Pins) * **Compression Springs:** Each pin includes a spring that provides precise, consistent pressure on the electronic component (CPU, GPU, or FPGA). * **Push-Pin Mechanism:** Designed for 2-hole mounting, ensuring the heat sink stays level and maintains contact during vibration or mechanical shock. #### C. Thermal Interface Material (TIM) * **Pre-applied Interface:** This specific model usually comes with a pre-applied **T766** thermal phase-change material or tape, which fills microscopic air gaps between the component and the heat sink base. --- ### 3. Application Use Cases The ATS-10E-95-C2-R0 is typically used for cooling high-heat-generating components in industrial and consumer electronics: * **Microprocessors (CPUs) and FPGAs:** Used in embedded systems where space is limited but cooling is critical. * **Telecommunications Gear:** Cooling high-speed networking chips. * **Power Supplies:** Heat dissipation for power transistors and voltage regulators. --- ### 4. Thermal Performance Comparison (Calculated) Heat sink efficiency is measured by how much the temperature rises per Watt of power dissipated (°C/W). ```python # Simplified Thermal Calculation Example power_dissipation = 10.0 # Watts thermal_resistance = 7.29 # Celsius per Watt (at low airflow) # Temperature rise above ambient temp_rise = power_dissipation * thermal_resistance print(f"The component temperature will rise {temp_rise}°C above ambient air.") ```