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  • ATS-10E-99-C2-R0

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    The **ATS-10E-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications The part belongs to the **pushPIN™** series, which uses a specific hardware mounting mechanism for reliable attachment. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Size** | 45mm x 45mm | | **Height** | 20mm | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | ~11.51 °C/W (at 100 LFM) | --- ### 2. Key Component Features #### A. The Fin Design * **Pitch:** The "99" in the part number refers to a specific fin configuration. It uses a **Fine Pitch** pattern, which increases the surface area for heat dissipation. * **Pattern:** It features a cross-cut design that allows air to flow through the fins from multiple directions, making it efficient for systems with varying airflow patterns. #### B. The pushPIN™ Mounting System Unlike adhesive-based heat sinks, this part uses a mechanical spring-loaded pin system. * **Reliability:** Ensures constant pressure on the electronic component (TIM - Thermal Interface Material). * **Security:** Prevents the heat sink from shifting or falling off during vibration or shipping. #### C. Thermal Interface Material (TIM) * The **"C2"** designation typically indicates that the heat sink comes pre-applied with high-performance thermal grease or a phase-change material to ensure immediate, efficient heat transfer from the chip to the aluminum base. --- ### 3. Applications This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed processors in switches and routers. 2. **Industrial PCs:** Maintaining stability in fanless or high-airflow enclosures. 3. **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling. --- ### 4. Part Number Breakdown ```text ATS - 10 E - 99 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Thermal Material (C2 = T766 Grease) | | | +------------ Fin Configuration/Pitch | | +----------------- Height Code (E = 20mm) | +-------------------- Attachment Type (10 = pushPIN) +------------------------- Advanced Thermal Solutions (Manufacturer) ```
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the optimal 11.51 °C/W thermal resistance?
    • ⤷ How does the Blue Anodized finish affect the performance or durability of the heat sink?
    • ⤷ What is the specific PCB hole pattern required for the pushPIN mounting system?