ATS-10E-99-C2-R0
AI

The **ATS-10E-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
### 1. Technical Specifications
The part belongs to the **pushPIN™** series, which uses a specific hardware mounting mechanism for reliable attachment.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Base Size** | 45mm x 45mm |
| **Height** | 20mm |
| **Fin Type** | Fine Pitch (Cross-Cut) |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | ~11.51 °C/W (at 100 LFM) |
---
### 2. Key Component Features
#### A. The Fin Design
* **Pitch:** The "99" in the part number refers to a specific fin configuration. It uses a **Fine Pitch** pattern, which increases the surface area for heat dissipation.
* **Pattern:** It features a cross-cut design that allows air to flow through the fins from multiple directions, making it efficient for systems with varying airflow patterns.
#### B. The pushPIN™ Mounting System
Unlike adhesive-based heat sinks, this part uses a mechanical spring-loaded pin system.
* **Reliability:** Ensures constant pressure on the electronic component (TIM - Thermal Interface Material).
* **Security:** Prevents the heat sink from shifting or falling off during vibration or shipping.
#### C. Thermal Interface Material (TIM)
* The **"C2"** designation typically indicates that the heat sink comes pre-applied with high-performance thermal grease or a phase-change material to ensure immediate, efficient heat transfer from the chip to the aluminum base.
---
### 3. Applications
This part is commonly found in the following electronic environments:
1. **Telecommunications:** Cooling of high-speed processors in switches and routers.
2. **Industrial PCs:** Maintaining stability in fanless or high-airflow enclosures.
3. **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling.
---
### 4. Part Number Breakdown
```text
ATS - 10 E - 99 - C2 - R0
| | | | | |
| | | | | +-- Revision Code
| | | | +------- Thermal Material (C2 = T766 Grease)
| | | +------------ Fin Configuration/Pitch
| | +----------------- Height Code (E = 20mm)
| +-------------------- Attachment Type (10 = pushPIN)
+------------------------- Advanced Thermal Solutions (Manufacturer)
```
- ⤷
What are the airflow requirements to achieve the optimal 11.51 °C/W thermal resistance?
- ⤷ How does the Blue Anodized finish affect the performance or durability of the heat sink?
- ⤷ What is the specific PCB hole pattern required for the pushPIN mounting system?