The **ATS-10F-03-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 40mm x 40mm x 9.0mm | | **Fin Style** | Fine Pitch (straight or cross-cut) | | **Thermal Resistance** | Approx. 15.85° C/W (@ 200 LFM) | --- ### 2. Major Electronic Components While the heat sink itself is a passive mechanical part, its design includes several critical "parts" that interact with electronic hardware: #### A. The Heat Sink Body (Aluminum 6063) * **Role:** Conducts heat away from the silicon die or component package. * **Design:** Uses a high-aspect-ratio fin design to maximize surface area within a small footprint (40mm), allowing for better convection in air-cooled systems. #### B. Push Pin Attachment Mechanism * **Structure:** Two flexible plastic pins with integrated steel or brass springs. * **Function:** Ensures consistent pressure (clamping force) between the heat sink and the electronic component. This is critical for minimizing the thermal interface resistance. #### C. Thermal Interface Material (TIM) * **Pre-Applied:** This specific model typically comes with **Chomerics T766** or a similar high-performance phase-change material/thermal pad pre-applied to the base. * **Role:** Fills microscopic air gaps between the heat sink base and the electronic chip to facilitate efficient heat transfer. --- ### 3. Applications in Electronics The ATS-10F-03-C2-R0 is commonly used in the following electronic environments: 1. **Telecommunications:** Cooling high-speed ASICs in routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical space is limited (only 9mm high). 3. **Power Electronics:** Dissipating heat from MOSFET arrays or power modules. --- ### 4. Thermal Performance Overview The performance is highly dependent on the Airflow Velocity (Measured in Linear Feet per Minute - LFM): * **@ 200 LFM:** 15.85 °C/W * **@ 400 LFM:** 7.50 °C/W * **@ 600 LFM:** 5.20 °C/W