The **ATS-10F-05-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "push-pin" series designed for secure mounting on Printed Circuit Boards (PCBs). ### 1. Component Specifications The following table outlines the physical and thermal properties of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10F-05-C3-R0 | | **Product Type** | Heat Sink (Passive Cooling) | | **Base Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | ~1.5°C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics This heat sink features a **Fine Pitch Straight-Fin** design. This is optimized for high-performance cooling in environments where there is steady airflow (forced convection). * **Fin Style:** Straight-fin design provides the largest surface area for heat dissipation while maintaining a low pressure drop. * **Material:** Made from 6063 Aluminum, which offers high thermal conductivity and is lightweight. * **Surface Treatment:** The "Blue Anodized" finish is not just aesthetic; it increases surface emissivity for better radiation cooling and protects the aluminum from corrosion. --- ### 3. Mounting and Assembly The "R0" suffix indicates specific mounting hardware configurations. The attachment mechanism is a crucial part of the electronic assembly: * **Push-Pin Mechanism:** Uses a spring-loaded pin that passes through pre-drilled holes in the PCB. This ensures constant pressure on the semiconductor (CPU/GPU/FPGA), which optimizes heat transfer. * **Springs:** Usually stainless steel or brass, providing a specific "compression force" to ensure the Thermal Interface Material (TIM) fills all microscopic gaps. --- ### 4. Technical Drawing & Airflow The performance of the ATS-10F-05-C3-R0 is highly dependent on airflow velocity (measured in Linear Feet per Minute - LFM): ```text Heat Dissipation Flow: Semiconductor Die -> TIM (T766) -> Aluminum Base -> Fins -> Ambient Air (Forced) ``` | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 1.50 | | 400 | 0.90 | | 600 | 0.70 | --- ### 5. Common Applications * **Embedded Systems:** Cooling for ARM-based processors. * **Telecommunications:** Cooling for ASICs in switches and routers. * **Power Supplies:** Dissipating heat from high-power MOSFETs or IGBTs.