The **ATS-10F-08-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is designed for high-efficiency cooling in constrained spaces. --- ### 1. Technical Specifications The part number encodes specific data regarding its dimensions, thermal performance, and attachment method. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 22.86mm | | **Thermal Resistance** | 1.50°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Features #### A. The maxiFLOW™ Design Unlike standard extruded heat sinks, the maxiFLOW™ design features a **tapered fin structure**. * **Purpose:** This reduces pressure drop and increases surface area. * **Electronic Benefit:** It allows for maximum air intake even in dense PCB environments where airflow might be turbulent or restricted. #### B. pushPIN™ Attachment System This heat sink utilizes a specialized mechanical attachment rather than simple adhesive. * **Components:** Brass or plastic pins and stainless steel springs. * **Benefit:** Provides consistent pressure (clamping force) across the electronic component (CPU/GPU/FPGA), ensuring the **Thermal Interface Material (TIM)** performs at peak efficiency without risking mechanical stress damage to the silicon die. #### C. Thermal Interface Material (TIM): T766 The unit comes with **T766** pre-applied to the base. * **Function:** This is a phase-change material or high-conductivity grease that fills the microscopic air gaps between the electronic component and the aluminum heat sink base. * **Benefit:** Minimizes contact resistance, ensuring heat is pulled away from the electronics immediately. --- ### 3. Common Applications This specific part is typically found in high-reliability electronic systems where heat dissipation is critical: 1. **Telecommunications:** Network switches and routers. 2. **Power Supplies:** Cooling MOSFETs or power modules. 3. **Computing:** Embedded processors, FPGAs, and ASICs. 4. **Industrial Controls:** High-load motor drivers or automation controllers. --- ### 4. Dimensional Summary (Table) | Parameter | Value | | :--- | :--- | | **Length (A)** | 45.00 mm | | **Width (B)** | 45.00 mm | | **Height (C)** | 22.86 mm | | **Fin Style** | Spread Fin (maxiFLOW) |