The **ATS-10F-10-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Fin Depth)** | 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.89 °C/W (at 100 LFM) | | **Flow Orientation** | XC (Cross-Cut) / Straight Fin | --- ### 2. Design & Components This part is composed of several critical electronic-mechanical features: * **Heat Sink Body:** A square aluminum block with vertical fins. The 25mm height provides a large surface area for heat dissipation into the surrounding air. * **Push-Pin Attachment:** Instead of messy adhesives, this part uses a mechanical plastic or brass pin with a stainless steel spring. This ensures constant **interface pressure**, which is vital for thermal transfer. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** (a high-performance thermal phase-change material) to fill microscopic air gaps between the component and the sink. * **Cross-Cut (XC) Fin Pattern:** This allows for multi-directional airflow, meaning it performs well even if the cooling fan isn't perfectly aligned with the fins. --- ### 3. Application Use Cases The ATS-10F-10-C2-R0 is commonly found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** Industrial PCs where mechanical stability is required (the push-pins prevent the sink from falling off due to vibration). 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data *Measured in °C/W (Lower is better)* | Airflow Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 7.89 | 2.13 | 1.21 | ---