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  • ATS-10F-11-C2-R0

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    The **ATS-10F-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-10F-11-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W)** | 50.00mm x 50.00mm | | **Height** | 10.00mm | | **Thermal Resistance** | 18.78°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance Phase Change) | --- ### 2. Component Features * **Fin Design (Straight Fin):** This model features a straight fin design. This is optimized for high-velocity airflow environments where air moves in a specific direction across the fins. * **Push-Pin Attachment:** Instead of using messy adhesives or expensive screws, this part uses a spring-loaded plastic push-pin system. This ensures consistent pressure between the heat sink and the chip for better heat transfer. * **Pre-Applied TIM:** The "C2" in the part number indicates it comes with **T766 thermal interface material** pre-applied to the base. This saves assembly time and ensures a uniform thermal bond. * **Material properties:** The aluminum construction offers a balance of lightweight design and excellent thermal conductivity, while the blue anodized finish provides corrosion resistance and aesthetic appeal. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying the exact variant: | Segment | Meaning | | :--- | :--- | | **ATS-10** | Series/Brand Designation | | **F** | Fin Type (Straight Fin) | | **11** | Height (10.0mm in this specific series configuration) | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Implementation Code Example When designing a PCB footprint for this heat sink, the hole spacing is critical. Below is a conceptual representation of the mounting hole coordinates (values are illustrative for a 50x50 body): ```cpp // Schematic/Layout Note for ATS-10F-11-C2-R0 // Units: mm struct HeatSinkFootprint { float body_width = 50.0; float body_length = 50.0; float hole_spacing = 43.0; // Distance between push-pin holes float hole_diameter = 3.0; // Standard push-pin drill size }; ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between straight fin and cross-cut fin heat sinks?
    • ⤷ How do I calculate the required airflow (LFM) for this heat sink?
    • ⤷ Are there alternative mounting options if push-pins are not supported on my PCB?