The **ATS-10F-115-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for efficient heat dissipation in electronic components like CPUs, GPUs, and high-power chipsets. --- ## 1. Technical Specifications Below are the key physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Mounting Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 1.95°C/W @ 200 LFM | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ## 2. Component Breakdown ### A. The Heat Sink Body * **Material:** Made from high-grade aluminum which provides a balance between weight and thermal conductivity. * **Geometry:** It features a cross-cut fin design. This allows for multi-directional airflow, making it effective in systems where the direction of the cooling fan may vary. ### B. Mounting Mechanism (Push-Pin) * The part uses a **plastic push-pin** with a brass spring. * **Benefit:** This provides consistent pressure (preload) on the electronic chip, which ensures maximum contact between the chip surface and the heat sink, optimizing heat transfer. ### C. Thermal Interface Material (TIM) * The **C2** in the part number indicates the presence of **T766 phase-change material**. * **Function:** This material fills the microscopic air gaps between the component and the heat sink. It remains solid at room temperature but flows when the device heats up, providing superior thermal coupling. --- ## 3. Part Number Decoding Understanding the "ATS-10F-115-C2-R0" nomenclature: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **10F:** Series identifier (typically relates to fin density and height). * **115:** Specific size and layout configuration. * **C2:** Indicates the specific **Thermal Interface Material** (T766). * **R0:** Revision code (Standard version). --- ## 4. Usage Scenario This component is typically found in: 1. **Network Switches:** Cooling high-speed processors. 2. **Industrial PCs:** Where vibration resistance is needed (the spring-loaded pins prevent the heat sink from shifting). 3. **Power Supplies:** Managing heat for MOSFETs or bridge rectifiers.