ATS-10F-12-C2-R0
AI

The **ATS-10F-12-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) designed for cooling integrated circuits (ICs) and other electronic components.
Below is a detailed breakdown of its specifications and electronic characteristics.
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### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Thermal Resistance** | 15.86°C/W (@ 100 LFM) |
| **Attachment Method** | Push-Pin |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm |
| **Weight** | 33.11 grams |
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### 2. Design and Engineering Features
The part is engineered to dissipate heat from surface-mount components to prevent thermal throttling or hardware failure.
* **Fin Configuration:** It utilizes a **Fine Pitch** design. This increases the surface area available for heat transfer, making it highly effective in systems with forced air cooling (fans).
* **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, this part uses a mechanical push-pin system. This ensures consistent pressure across the interface for optimal thermal conductivity.
* **Material Science:** Made from high-grade aluminum, which offers a balance between thermal conductivity and lightweight properties. The blue anodized finish provides corrosion resistance and increased emissivity.
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### 3. Electronic Application Use-Cases
This heat sink is typically found in the following electronic environments:
1. **Networking Hardware:** Cooling CPUs or ASICs in routers and switches.
2. **Embedded Systems:** Used on motherboards where vertical clearance is limited (12.7mm height).
3. **Power Electronics:** Dissipating heat from high-speed FPGA or DSP chips.
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### 4. Part Number Breakdown (Nomenclature)
The part number identifies specific attributes:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **10F:** Series/Fin type identifier.
* **12:** Height in millimeters (approximate).
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision or RoHS compliance status.
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What is the importance of 'Thermal Resistance' in this heat sink?
- ⤷ How does the push-pin mounting system compare to thermal adhesive?
- ⤷ Can this heat sink be used in a passive cooling environment without fans?