The **ATS-10F-126-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" attachment series designed for cooling integrated circuits (ICs). --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-10F-126-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Heat Sink Type** | Blue-Anodized Cross-Cut Fin | | **Thermal Resistance** | 5.47°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm | --- ### Key Design Components #### 1. Material and Coating The part is fabricated from high-grade aluminum. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and increases thermal emissivity, allowing the part to radiate heat more effectively. #### 2. Fin Configuration (Cross-Cut) The fins are designed in a cross-cut pattern. This allows for **multi-directional airflow**, meaning the heat sink performs well even if the air is not blowing directly down one specific channel. This is ideal for crowded PCB environments where airflow patterns may be turbulent or irregular. #### 3. Attachment Mechanism (Push-Pin) This specific model uses a push-pin mechanism with a brass or plastic core and a stainless steel spring. * **Benefits:** It provides consistent pressure (Load) across the thermal interface material (TIM), ensuring maximum heat transfer from the chip to the sink. * **Installation:** Requires pre-drilled holes in the PCB. #### 4. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the part comes with **T766** phase-change material or a similar high-performance thermal pad pre-applied to the base. This eliminates the need for manual thermal paste application. --- ### Application Usage This heat sink is commonly used for cooling: * **CPUs/GPUs** in embedded systems. * **FPGAs and ASICs** in networking equipment. * **Power modules** that generate significant localized heat. ---