The **ATS-10F-127-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "push pin" series, designed for cooling integrated circuits (ICs) and other electronic packages. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 9.15 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Fin Type** | Straight Fin | --- ### Key Electronic Components & Features #### 1. Material and Conductivity The part is made from **Aluminum 6063**, which is the industry standard for heat sinks due to its high thermal conductivity and lightweight properties. The blue anodized finish is not just for aesthetics; it provides surface protection and slightly increases radiation heat transfer. #### 2. Attachment System (Push Pin) Unlike adhesive-based heat sinks, this model uses a mechanical **Push Pin** system with a compression spring. This is critical for electronic stability because: * It ensures consistent pressure across the surface of the chip. * It allows for thermal expansion and contraction without losing contact. * It is more reliable in high-vibration environments compared to thermal tape. #### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **T766 phase-change material** or a similar high-performance thermal grease. This fills the microscopic air gaps between the electronic component (like a CPU or FPGA) and the heat sink base to maximize heat transfer. #### 4. Fin Geometry The **Straight Fin** design is optimized for "forced air" environments (where a fan is present). The spacing and height (20mm) are engineered to balance the surface area for cooling with the resistance to airflow (pressure drop). --- ### Common Applications * **Processors (CPUs/GPUs):** Cooling high-heat microchips. * **FPGAs & ASICs:** Used in telecommunications and data centers. * **Power Supplies:** Managing heat in industrial power converters. ---