The **ATS-10F-128-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed to provide maximum airflow and cooling efficiency for electronic components like BGAs (Ball Grid Arrays). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Thermal Resistance** | 2.91°C/W (at 200 LFM) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Electronic Features #### A. Thermal Performance The primary role of this part in an electronic circuit is **heat dissipation**. It is engineered with a spread fin design that increases the surface area, allowing for better convection cooling in high-density PCB layouts. #### B. pushPIN™ Attachment Unlike adhesive-only heat sinks, this model uses a **pushPIN™** system. * **Mechanical Stability:** It provides a secure attachment to the PCB, ensuring constant pressure on the semiconductor. * **Spring Mechanism:** It features a brass component and a stainless steel spring to prevent damage to the chip during installation or vibration. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 thermal tape**. This ensures a low-impedance thermal path between the electronic component (CPU, GPU, or FPGA) and the aluminum heat sink, eliminating air gaps that trap heat. --- ### 3. Applications This specific heat sink is commonly found in: * **Telecommunications:** Cooling high-speed switching equipment. * **Computing:** Protecting processors and chipsets on motherboards. * **Power Electronics:** Managing heat for MOSFETs or power regulators.