The **ATS-10F-131-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions, Inc. (ATS). It is part of the "push-pin" series designed for easy mounting on Printed Circuit Boards (PCBs). --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Product Series** | pushPIN™ | | **Heat Sink Type** | Top Mount / Cross-cut (Fine Pitch) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.60°C/W (at 1.0 m/s or 200 LFM) | | **Attachment Method** | Push-pin (Steel with Plastic Springs) | --- ### Key Design Components #### 1. Physical Dimensions * **Length & Width:** 60.00 mm x 60.00 mm. This is a relatively large surface area, ideal for cooling larger ICs (Integrated Circuits) or FPGAs. * **Height:** 20.00 mm. The "low profile" nature allows it to fit into standard rack-mount chassis or compact enclosures. * **Fin Style:** It features a **Straight Fin** design which is optimized for high-performance airflow environments. #### 2. Material and Conductivity The heat sink is made from **AL6063-T5 aluminum**, which provides an excellent balance between thermal conductivity, weight, and structural integrity. The **Blue Anodized** finish is not just aesthetic; it increases the surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. #### 3. Mounting Mechanism (Push-Pin) The "10F" in the part number indicates the specific mounting kit. * The system uses pre-drilled holes in the PCB. * **Springs:** Provides a consistent "Force-on-Chip" to ensure the thermal interface material (TIM) is compressed evenly, maximizing heat transfer. --- ### Thermal Interface Material (TIM) This specific part comes pre-applied with **ATS-PPS-10**, which is a high-performance thermal grease or pad. This eliminates the need for manual application of thermal paste, reducing assembly time and ensuring a consistent thermal bond between the electronic component and the heat sink. --- ### Applications * **CPUs/GPUs:** Cooling microprocessors in industrial computing. * **Telecommunications:** High-speed networking hardware (Routers/Switches). * **Power Electronics:** Cooling MOSFETs or IGBT modules.