The **ATS-10F-133-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "maxiFLOW" product line. --- ## 1. Technical Specifications This part is designed to provide thermal management for high-heat electronic components like BGA (Ball Grid Array) processors and FPGAs. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push-Pin (2-Pin) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm | | **Fin Style** | Tapered (maxiFLOW™) | | **Thermal Resistance** | 7.42°C/W (at 200 LFM) | | **Spring Type** | Brass (Nickel Plated) | --- ## 2. Component Composition The part consists of several distinct electronic-mechanical elements: ### A. The Heat Sink Body * **Fabrication:** Extruded aluminum alloy. * **Coating:** Blue anodized finish which provides a durable surface and increases thermal emissivity. * **Fin Geometry:** It uses a high-aspect-ratio "tapered fin" design. This allows for increased surface area while minimizing pressure drop across the component. ### B. The Attachment System (Push-Pin) * **Pins:** Two brass pins designed to pass through pre-drilled holes in a PCB (Printed Circuit Board). * **Springs:** Compression springs ensure a consistent and reliable downward force, maintaining optimal contact between the heat sink and the electronic chip. ### C. Thermal Interface Material (TIM) * The "-R0" suffix typically indicates that the part comes pre-applied with **Phase Change Material (PCM)** or high-performance thermal tape. This eliminates the need for manual thermal paste application during assembly. --- ## 3. Performance Metrics The effectiveness of this electronic part is measured by its **Thermal Resistance (Rth)**. As airflow increases, the resistance to heat transfer decreases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 7.42 | | 300 | 5.41 | | 400 | 4.44 | | 600 | 3.52 | --- ## 4. Typical Applications This part is commonly found in the following electronic environments: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs where space is constrained but heat is high. * **Power Supplies:** Managing heat from MOSFETs or Power Management ICs (PMICs).