The **ATS-10F-134-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions** | 70mm x 70mm x 15mm | | **Fin Style** | Straight Fin | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.44° C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical attributes: * **ATS-10F**: Refers to the series and specific manufacturing batch/family. * **134**: Represents the specific dimensions and fin density configuration. * **C2**: Indicates the thermal interface material (TIM) and color (usually T766 or similar high-performance grease). * **R0**: Refers to the revision level or packaging standards. --- ### 3. Key Features 1. **Push-Pin Attachment**: This model uses a spring-loaded push-pin mechanism. This ensures consistent pressure on the component (chip), which optimizes heat transfer. 2. **Straight Fin Design**: This geometry is ideal for environments with consistent airflow (forced convection), allowing air to pass through the channels efficiently. 3. **Low Profile**: At only 15mm in height, it is designed for space-constrained electronic enclosures or 1U/2U rack servers. 4. **Pre-applied TIM**: These units often come with a pre-applied Thermal Interface Material (Phase Change Material) to simplify assembly and ensure maximum thermal conductivity. --- ### 4. Typical Applications * **Embedded Systems**: Industrial computers requiring passive or active cooling. * **Telecommunications**: Network switches and routers where air is forced through the chassis. * **Power Electronics**: Cooling voltage regulators or power modules.