The part number **ATS-10F-147-C3-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 10mm | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 13.65°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Spring Type** | Compression Spring | --- ### 2. Part Number Breakdown Understanding the nomenclature helps identify the specific configuration of the part: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **10**: Series type / Pin attachment style. * **F**: Fin type (Straight). * **147**: Specific geometry/size code (35mm x 35mm). * **C3**: Thermal Interface Material (TIM). "C3" usually denotes **T766** high-performance thermal phase-change material. * **R0**: Revision/Packaging code. --- ### 3. Key Components & Design The assembly consists of four main electronic packaging elements: 1. **Heat Sink Body**: An extruded aluminum block with vertical fins. The low profile (10mm) is designed for tight spaces or server enclosures with restricted airflow. 2. **Push Pins**: Two plastic pins that snap into pre-drilled holes on the Printed Circuit Board (PCB). This ensures consistent pressure on the chip. 3. **Compression Springs**: These sit between the pin head and the heat sink, providing a specific downward force to maximize contact between the sink and the electronic component. 4. **Thermal Interface Material (TIM)**: Pre-applied to the base. This fills microscopic air gaps between the component and the heat sink to improve heat transfer. --- ### 4. Typical Applications * **Network Switches**: Cooling high-speed processing chips. * **Embedded Systems**: Small form factor motherboards. * **Power Supplies**: Dissipating heat from MOSFETs or voltage regulators. * **Telecommunications**: Cooling ASICs in line cards.