The **ATS-10F-182-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 7.48°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Pin Pitch** | 38mm | --- ### 2. Key Design Features * **Fine Pitch Fin Design:** The "182" in the part number indicates a specific fin pattern (Cross-cut) designed to maximize surface area and allow for multi-directional airflow. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical attachment system consisting of a plastic pin and a compression spring. This ensures consistent pressure and reliable contact with the semiconductor surface. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal phase change material, which optimizes heat transfer from the chip to the aluminum base. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying variations: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **10F:** Series designation (High-performance pushPIN). * **182:** Specific fin geometry and size configuration. * **C1:** Material and Finish (Aluminum / Blue Anodized). * **R0:** Revision or RoHS compliance status. --- ### 4. Application Use Cases This part is typically found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Industrial PCs:** Ensuring thermal stability in fanless or restricted-airflow environments. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.