The **ATS-10F-186-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with spring) | | **Thermal Resistance** | 2.80°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin | | **Pressure Type** | Low Pressure | --- ### 2. Physical Design & Features #### A. Heat Sink Geometry * **Square Profile:** The 45mm x 45mm footprint is standard for mid-sized BGAs (Ball Grid Arrays). * **Fin Configuration:** The straight fin design allows for airflow in a specific direction, making it ideal for systems with a defined chassis airflow (ducted or fan-driven). #### B. Attachment Mechanism (Push Pin) This model utilizes a **plastic push pin** with a brass spring. * **Reliability:** Provides consistent pressure on the processor, ensuring maximum contact with the thermal interface material (TIM). * **Ease of Assembly:** Does not require specialized tools; it snaps into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that it comes pre-applied with **ATS-53**, a high-performance phase-change thermal material. This eliminates the need for manual thermal paste application during assembly. --- ### 3. Electrical & System Considerations While the heat sink itself is a passive mechanical part, its role in an electronic circuit is critical for: 1. **Preventing Thermal Throttling:** Ensures the semiconductor stays below its Maximum Operating Junction Temperature ($T_j$). 2. **ESD Protection:** The blue anodized finish provides a level of electrical insulation, though the primary purpose is corrosion resistance and thermal radiation enhancement. 3. **Mechanical Clearance:** At 25mm high, engineers must ensure there is no interference with other tall components (like capacitors or RAM) on the PCB. --- ### 4. Summary Table | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Mounting Hole Pattern** | 38mm (diagonal) | | **Flow Direction** | Horizontal | | **Weight** | ~40-50 grams |