The **ATS-10F-207-C2-R0** is a high-performance electronic component known as a **Heat Sink**, specifically part of the "push pin" series manufactured by **Advanced Thermal Solutions (ATS)**. These components are critical for thermal management in electronic systems. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Specification | Detail | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 6.39°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Fin Style** | XCUT (Cross-cut) | | **Compression Spring** | Stainless Steel | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by Advanced Thermal Solutions: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **10F**: Refers to the specific series and mounting hole configuration. * **207**: Represents the specific dimensions and fin geometry profile. * **C2**: Indicates the material and finish (typically Blue Anodized Aluminum). * **R0**: Refers to the revision code or packaging standards. --- ### 3. Key Electronic Functions While the heat sink itself does not carry an electric current, it is essential for the reliability of the electronic components it protects: 1. **Thermal Dissipation**: It increases the surface area of high-heat components (like CPUs, GPUs, or MOSFETs), allowing heat to transfer into the surrounding air more efficiently. 2. **XCUT Fin Design**: The cross-cut pattern allows for "omni-directional" airflow. This means it can dissipate heat effectively regardless of which direction the cooling fan is blowing. 3. **Mechanical Stability**: The use of brass push-pins and a high-tension spring ensures a consistent "clamping force" against the semiconductor, which minimizes the thermal interface resistance. --- ### 4. Typical Applications * **Network Switches/Routers**: Cooling high-speed processing chips. * **Embedded Systems**: Providing passive cooling in industrial computers. * **Power Supplies**: Managing heat for voltage regulators.