The **ATS-10F-24-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-10F-24-C3-R0 | | **Type** | Heat Sink (Top Mount) | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | ~5.94 °C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Fin Type** | XC-Cut (Cross-Cut) | --- ### 2. Key Component Features #### A. XC-Cut Fin Design Unlike standard straight-fin heat sinks, the XC-Cut (cross-cut) geometry creates a grid of small pins or blocks. This design: * Increases surface area for heat dissipation. * Allows for **multidirectional airflow**, meaning it can receive air from any angle, making it ideal for systems with complex internal air currents. #### B. Push-Pin Attachment Mechanism The "10F" in the part number indicates a specific attachment style. It uses a **brass push-pin** with a high-tension spring. * **Benefits:** Provides consistent pressure on the heat source (CPU/GPU/FPGA) to ensure optimal thermal contact. * **Installation:** Requires pre-drilled holes in the PCB. #### C. Phase Change Material (PCM) This specific model usually comes with a **Thermal Interface Material (TIM)** pre-applied to the base. This fills microscopic air gaps between the heat sink and the electronic component to lower thermal resistance. --- ### 3. Application Use Cases This part is typically used to cool small-to-medium sized integrated circuits (ICs) such as: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** Industrial PCs where space is limited. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison *Performance varies based on Airflow (LFM - Linear Feet per Minute):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 5.94 | | 400 (2.0 m/s) | 3.52 | | 600 (3.0 m/s) | 2.85 |