ATS-10F-27-C3-R0
AI

The **ATS-10F-27-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance heat sink series designed for thermal management in electronic systems.
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## 1. Technical Specifications
The model number encodes specific physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm |
| **Fin Style** | XCUT (Cross-cut) |
| **Thermal Resistance** | Approx. 12.28 °C/W (at 100 LFM) |
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## 2. Component Breakdown
### A. The pushPIN™ Attachment System
One of the primary features of the `C3-R0` series is the **pushPIN™** mechanism. This replaces traditional adhesive tapes or clips.
* **Hardware:** It typically uses a brass or plastic pin with a stainless steel spring.
* **Reliability:** It ensures consistent pressure (TIM - Thermal Interface Material) against the heat source, improving heat transfer efficiency.
### B. XCUT Fin Design
The "XCUT" geometry means the fins are cut in a cross-pattern.
* **Airflow:** This design is optimized for environments where airflow may be omnidirectional or turbulent.
* **Surface Area:** It maximizes the surface area relative to the height (12.7mm), making it ideal for low-profile enclosures.
### C. Material and Finish
* **Aluminum 6063:** Provides a good balance between thermal conductivity and weight.
* **Blue Anodized Coating:** This is not just aesthetic; anodizing increases corrosion resistance and slightly improves emissivity for radiant cooling.
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## 3. Applications
This specific part is generally used to cool high-heat-generating surface-mount components such as:
1. **CPUs / GPUs:** Small form factor processors.
2. **FPGAs:** High-speed field-programmable gate arrays.
3. **Telecommunications Gear:** Routers and switches where vertical space is limited.
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## 4. Part Number Decoding (Breakdown)
| Segment | Meaning |
| :--- | :--- |
| **ATS-10** | Series Identifier (pushPIN™) |
| **F** | Fin Pitch (Fine) |
| **27** | Specific physical configuration index |
| **C3** | Thermal Interface Material (usually indicates T766 or similar) |
| **R0** | RoHS Compliant / Revision status |
- ⤷
What is the hole pattern requirement for the pushPIN attachment on this model?
- ⤷ How does the thermal resistance change at higher airflow (e.g.
- ⤷ 400 LFM)?
- ⤷ Are there alternative Thermal Interface Materials (TIM) available for this heat sink?