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  • ATS-10F-27-C3-R0

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    The **ATS-10F-27-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance heat sink series designed for thermal management in electronic systems. --- ## 1. Technical Specifications The model number encodes specific physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Resistance** | Approx. 12.28 °C/W (at 100 LFM) | --- ## 2. Component Breakdown ### A. The pushPIN™ Attachment System One of the primary features of the `C3-R0` series is the **pushPIN™** mechanism. This replaces traditional adhesive tapes or clips. * **Hardware:** It typically uses a brass or plastic pin with a stainless steel spring. * **Reliability:** It ensures consistent pressure (TIM - Thermal Interface Material) against the heat source, improving heat transfer efficiency. ### B. XCUT Fin Design The "XCUT" geometry means the fins are cut in a cross-pattern. * **Airflow:** This design is optimized for environments where airflow may be omnidirectional or turbulent. * **Surface Area:** It maximizes the surface area relative to the height (12.7mm), making it ideal for low-profile enclosures. ### C. Material and Finish * **Aluminum 6063:** Provides a good balance between thermal conductivity and weight. * **Blue Anodized Coating:** This is not just aesthetic; anodizing increases corrosion resistance and slightly improves emissivity for radiant cooling. --- ## 3. Applications This specific part is generally used to cool high-heat-generating surface-mount components such as: 1. **CPUs / GPUs:** Small form factor processors. 2. **FPGAs:** High-speed field-programmable gate arrays. 3. **Telecommunications Gear:** Routers and switches where vertical space is limited. --- ## 4. Part Number Decoding (Breakdown) | Segment | Meaning | | :--- | :--- | | **ATS-10** | Series Identifier (pushPIN™) | | **F** | Fin Pitch (Fine) | | **27** | Specific physical configuration index | | **C3** | Thermal Interface Material (usually indicates T766 or similar) | | **R0** | RoHS Compliant / Revision status |
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement for the pushPIN attachment on this model?
    • ⤷ How does the thermal resistance change at higher airflow (e.g.
    • ⤷ 400 LFM)?
    • ⤷ Are there alternative Thermal Interface Materials (TIM) available for this heat sink?