The **ATS-10F-32-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance push-pin heat sink series, specifically designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | push-PIN™ HS | | **Material** | Aluminum (typically with Blue Anodized finish) | | **Attachment Method** | Push-Pin with Springs | | **Thermal Resistance** | Approx. 21.5°C/W (Unducted @ 100 LFM) | | **Dimensions** | 35mm x 35mm | | **Height** | 15mm | | **Pin Pitch** | 2.54mm (Standard) | --- ### 2. Component Structure The device consists of three primary mechanical sub-components: 1. **Heat Sink Body:** A cross-cut fin design that allows for multi-directional airflow, making it effective in systems where air direction might change. 2. **Push-Pin:** Plastic or brass pins that lock the heat sink into pre-drilled holes on the Printed Circuit Board (PCB). 3. **Compression Spring:** Provides a precise "down-force" to ensure constant contact between the heat sink and the electronic chip, optimizing heat transfer. 4. **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance phase-change material or thermal pad. --- ### 3. Key Features * **High Performance:** Designed for high-density electronic packaging. * **Easy Installation:** The push-pin system allows for tool-free assembly, which reduces labor costs in manufacturing. * **Durability:** The blue anodized finish provides corrosion resistance and increased surface emissivity. * **Reliability:** The spring-loaded mechanism ensures that the heat sink remains attached even under high vibration or mechanical shock. --- ### 4. Thermal Performance Data Performance varies based on the airflow (velocity) within the electronics enclosure: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 21.46 | | 200 | 1.0 | 11.81 | | 300 | 1.5 | 6.69 | | 400 | 2.0 | 4.40 | --- ### 5. Application Use-Cases * **Telecommunications:** Cooling of routers and switches. * **Computing:** Secondary heat management for chipsets or power regulators. * **Industrial:** Protection for motor controllers or embedded PC modules.