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  • ATS-10F-35-C3-R0

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    The **ATS-10F-35-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *pushPIN™* series, designed for efficient heat dissipation in compact electronic systems. --- ### 1. Technical Specifications The part number provides specific details regarding its dimensions and thermal performance: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 10mm | | **Pitch** | Fine Pitch (High fin density) | | **Thermal Resistance** | ~22.0 °C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | --- ### 2. Physical Construction The device consists of three primary sub-components: 1. **Extruded Aluminum Body:** The main block features a high density of fins to maximize the surface area-to-volume ratio, allowing air to carry heat away from the semiconductor. 2. **Thermal Interface Material (TIM):** This part usually comes with a pre-applied **T412** phase-change material or equivalent, which fills microscopic air gaps between the chip and the heat sink. 3. **Push-Pin Mounting:** Unlike adhesive-based sinks, this uses a brass or plastic pin with a stainless steel spring to ensure consistent pressure and secure mechanical attachment to the PCB. --- ### 3. Application Use Cases This specific heat sink is typically used for low-profile cooling requirements in the following areas: * **Network Switches/Routers:** Cooling BGAs (Ball Grid Arrays) or FPGAs. * **Embedded Systems:** Industrial PCs where vertical space is limited to 10mm. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Automotive Electronics:** Thermal management for control modules. --- ### 4. Part Number Breakdown The nomenclature **ATS-10F-35-C3-R0** can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **10:** Series/Specific Designator. * **F:** Fine Pitch fin configuration. * **35:** Width/Length dimension (35mm). * **C3:** Specific thermal/material configuration. * **R0:** Revision or RoHS compliance indicator. ---
    ✨ Follow-up Questions
    • ⤷ What are the advantages of push-pin mounting over adhesive tape?
    • ⤷ How does 'LFM' airflow speed affect the thermal resistance of this part?
    • ⤷ Are there taller versions of the 35mm x 35mm ATS series for higher heat loads?