ATS-10F-35-C3-R0
AI

The **ATS-10F-35-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *pushPIN™* series, designed for efficient heat dissipation in compact electronic systems.
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### 1. Technical Specifications
The part number provides specific details regarding its dimensions and thermal performance:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 35mm x 35mm |
| **Height** | 10mm |
| **Pitch** | Fine Pitch (High fin density) |
| **Thermal Resistance** | ~22.0 °C/W (at 100 LFM) |
| **Fin Pattern** | Straight Fin |
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### 2. Physical Construction
The device consists of three primary sub-components:
1. **Extruded Aluminum Body:** The main block features a high density of fins to maximize the surface area-to-volume ratio, allowing air to carry heat away from the semiconductor.
2. **Thermal Interface Material (TIM):** This part usually comes with a pre-applied **T412** phase-change material or equivalent, which fills microscopic air gaps between the chip and the heat sink.
3. **Push-Pin Mounting:** Unlike adhesive-based sinks, this uses a brass or plastic pin with a stainless steel spring to ensure consistent pressure and secure mechanical attachment to the PCB.
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### 3. Application Use Cases
This specific heat sink is typically used for low-profile cooling requirements in the following areas:
* **Network Switches/Routers:** Cooling BGAs (Ball Grid Arrays) or FPGAs.
* **Embedded Systems:** Industrial PCs where vertical space is limited to 10mm.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
* **Automotive Electronics:** Thermal management for control modules.
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### 4. Part Number Breakdown
The nomenclature **ATS-10F-35-C3-R0** can be decoded as follows:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **10:** Series/Specific Designator.
* **F:** Fine Pitch fin configuration.
* **35:** Width/Length dimension (35mm).
* **C3:** Specific thermal/material configuration.
* **R0:** Revision or RoHS compliance indicator.
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- ⤷
What are the advantages of push-pin mounting over adhesive tape?
- ⤷ How does 'LFM' airflow speed affect the thermal resistance of this part?
- ⤷ Are there taller versions of the 35mm x 35mm ATS series for higher heat loads?