The **ATS-10F-45-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components like CPUs, GPUs, or FPGAs. ### 1. Key Technical Specifications Below are the primary physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Product Type** | Push-Pin Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Style** | Straight (optimized for airflow) | | **Thermal Resistance** | ~3.80°C/W (at 200 LFM) | | **Attachment Type** | Push-Pin (Plastic/Brass) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS:** Prefix for Advanced Thermal Solutions. * **10F:** Series identifier (typically referring to the fin profile and density). * **45:** Refers to the footprint length/width (45mm). * **C1:** Indicates the thermal interface material (TIM) or specific kit version. * **R0:** Revision code (standard version). --- ### 3. Electronic Design Features #### Thermal Management The core purpose of this part is to dissipate heat from high-power semiconductors. The **15mm height** provides a balance between surface area for cooling and a low profile for space-constrained PCB designs. #### Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the **Push-Pin** system provides several advantages for electronic assemblies: * **Constant Pressure:** A pre-assembled compression spring ensures uniform pressure across the component surface for maximum thermal transfer. * **Durability:** It is more secure than thermal tape in high-vibration environments. * **Standard Mounting:** Requires specific holes in the PCB, usually spaced at a standard pitch for 45mm components. #### Thermal Interface Material (TIM) This part usually comes with a pre-applied **Thermal Pad** or Phase Change Material. This fills the microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal resistance. --- ### 4. Typical Applications * **Networking Hardware:** Routers, switches, and base stations. * **Industrial PCs:** Cooling embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs and power regulators. * **Embedded Systems:** Single-board computers requiring active or passive cooling.