The **ATS-10F-45-C3-R0** is a high-performance thermal management component, specifically a **Heat Sink** from the **pushPIN™** series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 1.51 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 3.65 °C/W @ Static | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Pitch** | Fine Pitch | | **Pattern** | XC (Cross-Cut) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's design: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **10**: Series identifier (pushPIN™ Heat Sink). * **F**: Attachment Type (Fine Pitch). * **45**: Dimensions (45mm length/width). * **15 (Implied by series)**: Height (15mm profile). * **C3**: Thermal Interface Material (Pre-applied Phase Change Material or specific performance grade). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic/Thermal Features #### A. Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, this part uses a **flexible push-pin system**. This ensures: * **Constant Pressure:** The spring-loaded mechanism provides consistent contact with the CPU/GPU, optimizing heat transfer. * **Secure Mounting:** It prevents the heat sink from shifting due to mechanical shock or vibration. #### B. Cross-Cut (XC) Design The "XC" or cross-cut fin design allows for multi-directional airflow. This is critical in electronics enclosures where the direction of the cooling fan's exhaust may vary or be turbulent. #### C. Thermal Interface Material (TIM) The **C3** designation indicates that the part comes with a pre-applied thermal interface. This eliminates the need for manual application of thermal paste, reducing assembly time and ensuring a uniform layer between the component and the heat sink. --- ### 4. Typical Applications This part is commonly found in: * **Network Switches/Routers:** Cooling high-speed ASICs. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Embedded Computing:** Cooling processors in industrial motherboards.