The **ATS-10F-46-C3-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it belongs to the **pushPIN™** Heat Sink series, designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | Details | |:---|:---|:---| | **Heatsink Type** | pushPIN™ HS | High performance, clip-on design | | **Material** | Aluminum | Blue Anodized finish | | **Fin Style** | Straight Fin | Optimized for linear airflow | | **Attachment Type** | Push Pin | Secure mechanical attachment | | **Thermal Resistance** | 11.74 °C/W (Unducted) | At 100 LFM (Linear Feet per Minute) | | **Length/Width** | 25.00 mm x 25.00 mm | Square footprint | | **Height** | 25.00 mm | Vertical clearance requirement | | **Pitch** | 30.00 mm | Hole-to-hole spacing | --- ## 2. Component Features ### A. Material and Coating * **Base Material:** Extruded aluminum (6063) provides a lightweight yet efficient medium for heat dissipation. * **Finish:** The **Blue Anodized** coating not only prevents corrosion but also increases surface emissivity, slightly improving radiation heat transfer. ### B. Attachment Mechanism (pushPIN™) The "R0" designation refers to the attachment kit. It uses a flexible, spring-loaded push-pin system: * **Pressure:** The spring ensures constant pressure on the thermal interface material (TIM). * **Ease of Use:** Allows for quick installation without complex tools, reducing the risk of PCB damage. ### C. Thermal Interface Material (TIM) * This specific model typically comes pre-applied with **T412**, a high-quality thermal tape or grease, ensuring there are no air gaps between the heat source and the sink. --- ## 3. Part Number Breakdown | Segment | Meaning | |:---|:---| | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **10** | Series/Product Family (pushPIN™) | | **F** | Fin style/pattern | | **46** | Specific dimensions/geometry code | | **C3** | Material/Finish code (Blue Anodized) | | **R0** | Attachment kit version | --- ## 4. Typical Applications * **Embedded Systems:** Cooling microcontrollers or FPGAs. * **Networking:** Switch and router ASICs. * **Power Electronics:** Voltage regulators and MOSFETs that generate significant localized heat.