The **ATS-10F-49-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, designed to provide efficient cooling for electronic components like processors, FPGAs, and ASICs. ### 1. Technical Specifications Below are the key mechanical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Pitch (Pattern)** | Fine Pitch | | **Thermal Resistance** | 26.55 °C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **10**: Indicates the attachment type (pushPIN™ system). * **F**: Represents the Fin Pitch (Fine Pitch design for better surface area). * **49**: The specific size and design profile. * **C3**: Indicates the Thermal Interface Material (TIM) and finish type. * **R0**: Revision/Packaging code. --- ### 3. Key Electronic Cooling Features #### High-Efficiency Fin Design The heat sink utilizes a fine-pitch fin pattern. This increases the total surface area available for heat dissipation, making it highly effective in environments with forced air (fans). #### The pushPIN™ Attachment Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin system. - **Reliability:** Ensures consistent pressure (clamping force) on the electronic component. - **Safety:** Prevents the heat sink from shifting or falling off during vibration or shipping. - **Ease of Install:** Requires pre-drilled holes in the PCB. #### Pre-Applied Thermal Interface Material (TIM) The unit comes with **T412** thermal material already applied to the base. This eliminates the need for manual thermal paste application, ensuring a low-resistance thermal path between the chip and the aluminum body. --- ### 4. Ideal Applications * **Low-profile electronics:** The 10mm height makes it ideal for compact enclosures. * **Embedded Systems:** Used on microprocessors and small form-factor boards. * **Networking Hardware:** Cooling for switches and routers where airflow is controlled.