The **ATS-10F-52-C3-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" heat sink series, designed for high-performance cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Component Specifications The following table outlines the physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Attachment Method** | Push Pin (Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 25.0mm | | **Fin Type** | Cross-Cut (Straight Fin) | | **Thermal Resistance** | ~7.28 °C/W (at 100 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied phase change material) | --- ### 2. Detailed Technical Breakdown #### A. Attachment Mechanism (Push Pins) The "10F" in the part number indicates a specific push-pin configuration. * **Brass Push Pins:** These use a spring-loaded mechanism to provide a precise and consistent pressure on the processor. * **Reliability:** This method is more secure than adhesive tapes and is preferred for hardware that may experience vibrations or require maintenance. #### B. Thermal Performance The heat sink features a **cross-cut fin design**. This design allows for: * **Omnidirectional Airflow:** It can accept airflow from any direction, making it ideal for crowded PCB layouts where airflow patterns are unpredictable. * **Increased Surface Area:** The gaps between fins maximize the contact area with the air to dissipate heat more efficiently. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance phase-change material that softens as the chip heats up, filling microscopic air gaps between the heat source and the heat sink to ensure maximum thermal conductivity. --- ### 3. Common Applications This specific heat sink is typically found in: * **Networking Equipment:** Routers, switches, and gateways. * **Embedded Systems:** Industrial PCs and automation controllers. * **Telecommunications:** High-speed data processing units. ---