The **ATS-10F-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 6.36°C/W (at 100 LFM) | | **Fin Pattern** | Fine Pitch (Cross-Cut) | --- ### 2. Design Characteristics This heat sink is part of the **pushPIN™** line, which is optimized for modern PCB layouts where space and reliability are critical. * **Fin Geometry:** The "60" in the part number indicates a specific fin density and arrangement. The cross-cut design allows for multidirectional airflow, making it effective even in turbulent or non-linear cooling environments. * **Thermal Interface Material (TIM):** The "C2" suffix indicates that it comes pre-applied with high-performance thermal grease (typically T766) to ensure optimal heat transfer between the component and the heat sink. * **Material and Finish:** Made from extruded aluminum for lightweight and efficient conduction. The blue anodized finish provides corrosion resistance and increased emissivity. --- ### 3. Mounting System: pushPIN™ The **R0** designation refers to the mounting hardware package. The system uses a specialized pin and spring mechanism: 1. **Compression Springs:** Provide a precise amount of force to ensure the heat sink remains in contact with the component during vibration or thermal expansion. 2. **Easy Installation:** The pins snap into pre-drilled holes in the PCB, eliminating the need for adhesives or complicated bracket systems. --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Heat dissipation for MOSFETs and IGBTs.