The part number **ATS-10F-62-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Material** | Aluminum (Body) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 16.48°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Features #### 1. Push-Pin Attachment Mechanism The **"R0"** in the part number indicates a specific push-pin and spring assembly. * **Ease of Assembly:** Provides a consistent force for optimal thermal contact without the need for tools. * **Reliability:** The brass or plastic pins clip through pre-drilled holes in the PCB, ensuring the heat sink remains secure during vibration or shipping. #### 2. Thermal Interface Material (TIM) This part comes with **T766** pre-applied to the base. * **Purpose:** Fills microscopic air gaps between the component (chip) and the heat sink base to maximize heat transfer. * **Benefit:** Saves time during mass production and ensures consistent performance. #### 3. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Not only provides a professional look but also offers a level of electrical insulation and protection against corrosion. --- ### Comparison of Airflow Performance The efficiency of this part varies significantly based on the airflow (measured in Linear Feet per Minute - LFM) provided by system fans: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 16.48 | | 200 | 6.17 | | 400 | 4.08 | | 600 | 3.42 | --- ### Application Usage This specific heat sink is typically used for: * **BGA (Ball Grid Array) Components:** High-density chips that generate localized heat. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Networking Gear:** Cooling processors inside routers, switches, and modems.