The **ATS-10F-71-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-10F-71-C3-R0 | | **Base Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Thermal Resistance** | 6.77°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Attachment Mechanism (Push-Pins) The "R0" designation typically refers to the mounting hardware. This model uses a **plastic push-pin** mechanism combined with a stainless steel spring. * **Purpose:** It ensures consistent downward pressure on the component, which optimizes heat transfer. * **Installation:** It requires pre-drilled holes in the PCB (Printed Circuit Board). #### B. Heat Sink Geometry * **Straight Fins:** The fins run in one direction, making this heat sink ideal for systems with **forced air cooling** (fans) where the airflow direction is known and constant. * **Material:** It is made of Aluminum for a balance of lightweight properties and high thermal conductivity. The **Blue Anodized** finish protects the aluminum from corrosion and slightly improves radiant heat transfer. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * This eliminates the need for manual application of thermal paste. * The T766 pad is designed to fill microscopic air gaps between the heat sink base and the electronic chip, ensuring a low-resistance thermal path. --- ### 3. Electronic Application Use-Cases This specific heat sink is commonly found in the following electronic environments: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** For industrial PCs where durability and vibration resistance (provided by the push-pins) are required. 3. **Power Electronics:** Dissipating heat from large voltage regulators or FPGA chips.