The **ATS-10F-77-C3-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions, Inc. (ATS)* and is part of their "pushPIN™" line, designed to dissipate heat from integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Thermal Resistance** | 9.42°C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | Fine Pitch (Straight Fin) | | **Weight** | ~23 grams | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: - **ATS-10**: Refers to the product family/series. - **F**: Indicates a **Fine Pitch** fin pattern, optimized for high-performance airflow. - **77**: Represents the specific fin geometry and internal design code. - **C3**: This code designates the **Material and Finish** (typically Aluminum with a specific Blue Anodization). - **R0**: Indicates the version or revision of the design. --- ### 3. Key Electronic Functions While the heat sink itself does not carry electricity, it is critical for the "Electronic Health" of a system: 1. **Thermal Management:** It prevents "Thermal Throttling" in high-speed processors or Power Management ICs (PMICs). 2. **Extended Component Life:** By keeping junction temperatures low, it reduces the rate of chemical degradation inside silicon chips. 3. **Mechanical Stability:** The **pushPIN™** system uses a specific spring-hole pattern (20mm pitch) to ensure uniform pressure across the chip surface, which improves heat transfer efficiency via the Thermal Interface Material (TIM). --- ### 4. Comparison of Airflow Performance The effectiveness of this part scales with the velocity of the air provided by the system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.42 | | 300 (1.5 m/s) | 4.13 | | 500 (2.5 m/s) | 3.19 | | 700 (3.5 m/s) | 2.72 |