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  • ATS-10F-82-C3-R0

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    The **ATS-10F-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for easy and secure attachment to Printed Circuit Boards (PCBs). --- ## 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 30.00 mm x 30.00 mm x 25.00 mm | | **Pitch (Fin spacing)** | Fine | | **Pattern** | Straight-Fin | | **Thermal Interface (TIM)** | T412 (Pre-applied) | --- ## 2. Key Components & Design ### A. PushPIN™ Attachment System Instead of using messy adhesives or complex clips, this part uses a **push-pin and brass spring** mechanism. * **Pressure:** Ensures uniform pressure across the component for maximum heat transfer. * **Security:** Provides a robust mechanical connection that can withstand vibration. ### B. Thermal Interface Material (TIM) The part comes with **T412** pre-applied. T412 is a high-performance thermal pad that fills microscopic air gaps between the heat source (CPU/GPU/Transistor) and the heat sink base, significantly reducing thermal resistance. ### C. Straight-Fin Design The "Straight-Fin" geometry is optimized for **forced air cooling** (environments with fans). The fine pitch (spacing) provides a large surface area to dissipate heat quickly as air flows through the channels. --- ## 3. Thermal Performance Thermal resistance is measured in °C/W (Degrees Celsius per Watt). The lower the number, the more efficient the heat sink. | Air Velocity (m/s) | Thermal Resistance (Unducted) | | :--- | :--- | | 1.0 m/s | 10.97 °C/W | | 2.0 m/s | 4.02 °C/W | | 3.0 m/s | 3.17 °C/W | | 5.0 m/s | 2.44 °C/W | --- ## 4. Part Number Breakdown The nomenclature provides specific details about the part: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **10F:** Series/Attachment type * **82:** Specific geometry/Fin configuration * **C3:** Material/Thermal performance grade * **R0:** Revision/Packaging code ---
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern requirement on the PCB for this specific pushPIN size?
    • ⤷ How does the T412 thermal interface material compare to standard thermal paste?
    • ⤷ Can this heat sink be used in a passive cooling environment without a fan?