ATS-10F-82-C3-R0
AI

The **ATS-10F-82-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for easy and secure attachment to Printed Circuit Boards (PCBs).
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## 1. Technical Specifications
The following table highlights the core physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 30.00 mm x 30.00 mm x 25.00 mm |
| **Pitch (Fin spacing)** | Fine |
| **Pattern** | Straight-Fin |
| **Thermal Interface (TIM)** | T412 (Pre-applied) |
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## 2. Key Components & Design
### A. PushPIN™ Attachment System
Instead of using messy adhesives or complex clips, this part uses a **push-pin and brass spring** mechanism.
* **Pressure:** Ensures uniform pressure across the component for maximum heat transfer.
* **Security:** Provides a robust mechanical connection that can withstand vibration.
### B. Thermal Interface Material (TIM)
The part comes with **T412** pre-applied. T412 is a high-performance thermal pad that fills microscopic air gaps between the heat source (CPU/GPU/Transistor) and the heat sink base, significantly reducing thermal resistance.
### C. Straight-Fin Design
The "Straight-Fin" geometry is optimized for **forced air cooling** (environments with fans). The fine pitch (spacing) provides a large surface area to dissipate heat quickly as air flows through the channels.
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## 3. Thermal Performance
Thermal resistance is measured in °C/W (Degrees Celsius per Watt). The lower the number, the more efficient the heat sink.
| Air Velocity (m/s) | Thermal Resistance (Unducted) |
| :--- | :--- |
| 1.0 m/s | 10.97 °C/W |
| 2.0 m/s | 4.02 °C/W |
| 3.0 m/s | 3.17 °C/W |
| 5.0 m/s | 2.44 °C/W |
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## 4. Part Number Breakdown
The nomenclature provides specific details about the part:
* **ATS:** Manufacturer (Advanced Thermal Solutions)
* **10F:** Series/Attachment type
* **82:** Specific geometry/Fin configuration
* **C3:** Material/Thermal performance grade
* **R0:** Revision/Packaging code
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- ⤷
What is the hole pattern requirement on the PCB for this specific pushPIN size?
- ⤷ How does the T412 thermal interface material compare to standard thermal paste?
- ⤷ Can this heat sink be used in a passive cooling environment without a fan?