The **ATS-10F-83-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide high-efficiency cooling for electronic components. --- ### 1. Technical Specifications The part number encodes specific structural and material characteristics. Below are the core technical parameters: | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (High Thermal Conductivity) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.57°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precision sizing is critical for PCB layout and ensuring clearance from other electronic parts. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 25.00 mm * **Fin Style:** Straight-Fin (maxiFLOW™ spread fin geometry) --- ### 3. Key Electronic/Thermal Features #### A. maxiFLOW™ Design The heat sink features a unique "flared" or spread-fin design. This geometry maximizes the surface area while maintaining a low pressure drop, making it highly effective in forced-air environments (systems with fans). #### B. pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this part uses the **pushPIN™** system. This involves: * A brass or plastic pin. * A stainless steel spring to provide consistent pressure (omni-directional). * A secure mechanical connection to the PCB via pre-drilled holes. #### C. Thermal Interface Material (TIM) The "C1" in the part number indicates it comes with **T766** pre-applied. This is a phase-change material or high-performance thermal grease designed to eliminate air gaps between the chip (e.g., a BGA or FPGA) and the heat sink, ensuring maximum heat transfer. --- ### 4. Common Applications This specific size and thermal rating are typically found in the following electronic sectors: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Embedded Computing:** Protecting CPUs or FPGAs in industrial controllers. 3. **Power Supplies:** Managing heat in high-density power modules. ---