The **ATS-10F-86-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **maxiFLOW™** series, which is designed for high-performance cooling in environments with constrained airflow. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 3.16°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Style** | maxiFLOW (Tapered Fin) | | **Mounting Hole Pattern** | 35.00mm (Square) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment Unlike standard adhesive-based heat sinks, this part uses the **pushPIN™** system. This involves a spring-loaded mechanism that ensures: * **Constant Pressure:** Maintains a consistent interface between the heat sink and the electronic component (CPU, FPGA, or GPU). * **Reliability:** Resistant to shock and vibration, preventing the heat sink from detaching during shipping or operation. ### B. maxiFLOW™ Fin Geometry The fins are not simple vertical bars. They use a **tapered fin design** that: * Increases the surface area for heat dissipation. * Reduces pressure drop, allowing air to flow more efficiently through the fins even at low speeds. ### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **pre-applied Phase Change Material (T766)** or a similar high-performance thermal pad. This eliminates the need for manual application of thermal paste and ensures an even, thin layer for optimal heat transfer. --- ## 3. Common Applications This specific size and thermal rating are ideal for: * **Telecommunications Equipment:** Routers and switches. * **Embedded Systems:** High-heat generating SoCs (System on Chips). * **Power Supplies:** Cooling MOSFETs or power regulators. ---