The part number **ATS-10F-87-C3-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This component is part of their "push pin" attachment series, designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | Straight Fin | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 2.77°C/W (at 200 LFM) | | **Dimensions** | 35mm x 35mm x 20mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS-10**: Refers to the specific product series (Push-Pin Heat Sink). * **F**: Denotes a **Fine** pitch fin configuration (optimized for higher airflow). * **87**: Indicates the specific dimensions and footprint (35mm x 35mm). * **C3**: Refers to the material and finish (usually Blue Anodized Aluminum). * **R0**: Indicates the revision or specific packaging standard. --- ### 3. Key Electronic Cooling Features * **Push-Pin Attachment:** This part uses a brass push pin with a built-in compression spring. This ensures a secure, consistent mounting pressure on the electronic chip, which improves heat transfer through the Thermal Interface Material (TIM). * **Straight Fin Design:** The straight fin geometry is ideal for systems with **forced-air cooling** (fans), allowing air to pass through the fins with minimal pressure drop. * **T766 TIM:** The "R0" version comes with a pre-applied T766 phase-change material. This eliminates the need for manual thermal paste application, ensuring a uniform layer between the component and the heat sink. --- ### 4. Typical Applications These heat sinks are used in various electronic environments: 1. **Telecommunications:** Cooling network switches and routers. 2. **Industrial PC:** Thermal management for embedded processors. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. 4. **Consumer Electronics:** High-end audio/video processing chips.