The **ATS-10F-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to cool electronic components like CPUs, FPGAs, and power modules. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | ~1.60°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Features ### A. maxiFLOW™ Fin Geometry The "F" in the part number signifies the specialized fin profile. Unlike standard straight-fin heat sinks, this design features a tapered fin structure that increases the surface area while reducing pressure drop, making it highly efficient in environments with restricted airflow. ### B. pushPIN™ Attachment System This part utilizes a mechanical attachment system rather than adhesive. This is critical for high-reliability electronics because: * **Constant Pressure:** It ensures the thermal interface material (TIM) is compressed evenly against the chip. * **Reusability:** The heat sink can be removed and re-installed during prototyping or repair without damaging the PCB. * **Vibration Resistance:** The spring-loaded pins prevent the heat sink from shifting during mechanical shock. ### C. Thermal Interface Material (T766) The **C2** designation indicates that the part comes with **T766** pre-applied. This is a high-performance thermal pad that fills microscopic air gaps between the component (e.g., a processor) and the heat sink, significantly lowering the contact resistance. --- ## 3. Applications This specific heat sink is commonly used for: 1. **Telecommunications:** High-speed networking switches and routers. 2. **Embedded Computing:** Industrial PC boards and single-board computers. 3. **Power Electronics:** Cooling large MOSFETs or IGBT modules.