The **ATS-10F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed for cooling electronic chips such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific data about the physical and thermal properties of the device: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 40mm x 40mm | | **Height** | 10mm (Low Profile) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 22.00 °C/W (at 100 LFM) | | **Thermal Interface Material** | T412 (High Performance) | --- ### 2. Physical Design and Construction * **Low Profile:** At only 10mm high, this part is ideal for space-constrained electronics such as 1U servers, routers, or small form factor (SFF) embedded systems. * **Straight Fin Design:** This geometry is optimized for **forced air cooling**. The gaps between the fins allow air from a system fan to pass through easily, stripping heat away from the base. * **Blue Anodized Finish:** The surface is chemically treated for corrosion resistance and increased emissivity, which slightly improves radiative heat transfer. --- ### 3. Mounting System (pushPIN™) The "R0" designation usually refers to the specific mounting hardware included. The pushPIN™ system offers several advantages for PCB assembly: 1. **Uniform Pressure:** The integrated springs ensure that the heat sink applies consistent pressure to the chip, which is critical for the efficiency of the Thermal Interface Material (TIM). 2. **Vibration Resistance:** Secure attachment prevents the heat sink from shifting during shipping or industrial operation. 3. **Tool-less Installation:** Designed for quick manual assembly or automated processes. --- ### 4. Thermal Performance The efficiency of this part depends on the airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 22.0 | | **300 LFM (1.5 m/s)** | 9.0 | | **500 LFM (2.5 m/s)** | 6.5 | *Note: Lower °C/W indicates better cooling performance.* ---